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High-precision flip chip bonder - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

High-precision flip chip bonder Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. null/null
  2. 日精 本社 Tokyo//Machine elements and parts
  3. null/null
  4. アドウェルズ Fukuoka//Manufacturing and processing contract
  5. 5 ウェル Tokyo//Electronic Components and Semiconductors
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High-precision flip chip bonder Product ranking

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. High-precision flip chip bonder 'femto2'
  2. High-precision flip chip bonder: lambda2
  3. High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)" 日精 本社
  4. High-precision flip chip bonder "APAMA PLUS"
  5. 4 Ultrasonic High-Precision Flip Chip Bonder FA2000SS アドウェルズ

High-precision flip chip bonder Product List

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High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)"

High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)"

It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.

It enables bonding control at low loads compared to conventional flip chip bonding, significantly reducing load and stress damage to bumps, aluminum pads, wiring, and more. The thermal shrinkage compensation function during cooling prevents failures such as cracks and disconnections, achieving a high-yield, highly reliable bonding process. Moreover, it is an innovative system capable of achieving bonding with high precision of ±1μm at 3σ.

  • Bonding Equipment
  • High-precision flip chip bonder

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Ultrasonic High-Precision Flip Chip Bonder FA2000SS

Ultrasonic High-Precision Flip Chip Bonder FA2000SS

Ultrasonic flip chip bonder capable of high-precision implementation with ultrasonic processes.

The FA700 ultrasonic high-precision flip chip bonder enables the development of advanced semiconductor packaging technologies, such as three-dimensional semiconductors, through the ultrasonic bonding process. It allows for high-precision alignment with an IR transmission optical system and is equipped with high-precision positioning functions, including infrared optical systems. 【Features】 ○ High-precision positioning function ○ High-quality bonding ○ Detailed bonding condition settings For more information, please contact us or download the catalog.

  • Other mounting machines
  • High-precision flip chip bonder

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Ultrasonic High-Precision Flip Chip Bonder 'FA2000'

Ultrasonic High-Precision Flip Chip Bonder 'FA2000'

Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic bonding processes.

The "FA2000" is an ultrasonic high-precision flip chip bonder capable of high-precision alignment with an IR transmission optical system. It is equipped with high-precision positioning functions, such as infrared optical systems, and bonding control functions that meet the detailed condition settings required during research and development. Additionally, through high-quality bonding, it linearly controls the load in accordance with the increase in bonding area. 【Features】 ■ High-precision positioning function ■ High-quality bonding ■ Detailed bonding condition settings *For more details, please download the PDF or feel free to contact us.

  • Other processing machines
  • High-precision flip chip bonder

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High-precision flip chip bonder with multi-pin chip support

High-precision flip chip bonder with multi-pin chip support

High-performance flip chip bonder for multi-variety cell production lines.

By exchanging the head, it is possible to accommodate a wide range from thermal pressing methods to ultrasonic-assisted thermal pressing methods.

  • Bonding Equipment
  • Circuit board processing machine
  • Other semiconductor manufacturing equipment
  • High-precision flip chip bonder

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