We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for High-precision flip chip bonder.
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High-precision flip chip bonder Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

High-precision flip chip bonder Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. ファインテック日本 Tokyo//Industrial Electrical Equipment
  2. null/null
  3. ウェル Tokyo//Electronic Components and Semiconductors
  4. 4 日精 本社 Tokyo//Machine elements and parts
  5. 4 アドウェルズ Fukuoka//Manufacturing and processing contract
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High-precision flip chip bonder Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. High-precision flip chip bonder 'femto2' ファインテック日本
  2. High-precision flip chip bonder: lambda2 ファインテック日本
  3. High-precision, high-function flip chip bonder: sigma ファインテック日本
  4. 4 High-precision flip chip bonder "APAMA PLUS"
  5. 5 High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)" 日精 本社

High-precision flip chip bonder Product List

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High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)"

High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)"

It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.

It enables bonding control at low loads compared to conventional flip chip bonding, significantly reducing load and stress damage to bumps, aluminum pads, wiring, and more. The thermal shrinkage compensation function during cooling prevents failures such as cracks and disconnections, achieving a high-yield, highly reliable bonding process. Moreover, it is an innovative system capable of achieving bonding with high precision of ±1μm at 3σ.

  • Bonding Equipment

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Ultrasonic High-Precision Flip Chip Bonder FA2000SS

Ultrasonic High-Precision Flip Chip Bonder FA2000SS

Ultrasonic flip chip bonder capable of high-precision implementation with ultrasonic processes.

The FA700 ultrasonic high-precision flip chip bonder enables the development of advanced semiconductor packaging technologies, such as three-dimensional semiconductors, through the ultrasonic bonding process. It allows for high-precision alignment with an IR transmission optical system and is equipped with high-precision positioning functions, including infrared optical systems. 【Features】 ○ High-precision positioning function ○ High-quality bonding ○ Detailed bonding condition settings For more information, please contact us or download the catalog.

  • Other mounting machines

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Ultrasonic High-Precision Flip Chip Bonder 'FA2000'

Ultrasonic High-Precision Flip Chip Bonder 'FA2000'

Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic bonding processes.

The "FA2000" is an ultrasonic high-precision flip chip bonder capable of high-precision alignment with an IR transmission optical system. It is equipped with high-precision positioning functions, such as infrared optical systems, and bonding control functions that meet the detailed condition settings required during research and development. Additionally, through high-quality bonding, it linearly controls the load in accordance with the increase in bonding area. 【Features】 ■ High-precision positioning function ■ High-quality bonding ■ Detailed bonding condition settings *For more details, please download the PDF or feel free to contact us.

  • Other processing machines

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High-precision flip chip bonder with multi-pin chip support

High-precision flip chip bonder with multi-pin chip support

High-performance flip chip bonder for multi-variety cell production lines.

By exchanging the head, it is possible to accommodate a wide range from thermal pressing methods to ultrasonic-assisted thermal pressing methods.

  • Bonding Equipment
  • Circuit board processing machine
  • Other semiconductor manufacturing equipment

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High-precision flip chip bonder 'femto2'

High-precision flip chip bonder 'femto2'

Fully automatic high-precision die bonding machine

The model name femto2 from the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.3μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely shields against external influences, achieving a top-class yield and a stable assembly process. *For more details, please download the PDF or contact us.*

  • Other semiconductor manufacturing equipment

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High-precision, high-function flip chip bonder: sigma

High-precision, high-function flip chip bonder: sigma

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders that encompasses high precision and high functionality.

The model name sigma from the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N within a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, supporting wafer-level applications such as MEMS/MOEMS assembly, image sensor bonding, and chip packaging. The FINEPLACER sigma is designed for development applications that align with future-oriented assembly technologies, accommodating a variety of techniques and applications.

  • Bonding Equipment

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High-precision flip chip bonder: lambda2

High-precision flip chip bonder: lambda2

The FINEPLACER lambda 2 is a new standard model for high-precision die bonders and flip chip bonders.

Lambda2 is a new standard model of a high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact tabletop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies such as thermal eutectic, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact tabletop size, it is very easy to introduce into operations, and considering future scalability through a modular system, it is a highly cost-effective model. Lambda2 is a new standard model from Finetech, a German manufacturer specializing in die bonders, which has poured its unique know-how into this product. Its ultra-high precision and usability, realized through its unique design philosophy, leave no room for competitors to catch up. For more details, please refer to the PDF materials or feel free to contact us.

  • Bonding Equipment

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