We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for High-precision flip chip bonder.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

High-precision flip chip bonder - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

High-precision flip chip bonder Product List

1～7 item / All 7 items

Displayed results
Ultrasonic High-Precision Flip Chip Bonder FA2000SS

Ultrasonic High-Precision Flip Chip Bonder FA2000SS

Ultrasonic flip chip bonder capable of high-precision implementation with ultrasonic processes.

The FA700 ultrasonic high-precision flip chip bonder enables the development of advanced semiconductor packaging technologies, such as three-dimensional semiconductors, through the ultrasonic bonding process. It allows for high-precision alignment with an IR transmission optical system and is equipped with high-precision positioning functions, including infrared optical systems. 【Features】 ○ High-precision positioning function ○ High-quality bonding ○ Detailed bonding condition settings For more information, please contact us or download the catalog.

  • Other mounting machines
  • High-precision flip chip bonder

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Ultrasonic High-Precision Flip Chip Bonder 'FA2000'

Ultrasonic High-Precision Flip Chip Bonder 'FA2000'

Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic bonding processes.

The "FA2000" is an ultrasonic high-precision flip chip bonder capable of high-precision alignment with an IR transmission optical system. It is equipped with high-precision positioning functions, such as infrared optical systems, and bonding control functions that meet the detailed condition settings required during research and development. Additionally, through high-quality bonding, it linearly controls the load in accordance with the increase in bonding area. 【Features】 ■ High-precision positioning function ■ High-quality bonding ■ Detailed bonding condition settings *For more details, please download the PDF or feel free to contact us.

  • Other processing machines
  • High-precision flip chip bonder

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High-precision flip chip bonder with multi-pin chip support

High-precision flip chip bonder with multi-pin chip support

High-performance flip chip bonder for multi-variety cell production lines.

By exchanging the head, it is possible to accommodate a wide range from thermal pressing methods to ultrasonic-assisted thermal pressing methods.

  • Bonding Equipment
  • Circuit board processing machine
  • Other semiconductor manufacturing equipment
  • High-precision flip chip bonder

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Related Categories of High-precision flip chip bonder

COPYRIGHT © 2001-2026 IPROS CORPORATION ALL RIGHTS RESERVED.